Next-Generation High-Performance Memory for Smart Terminals

The uMCP (UFS-Based Multi-Chip Package) memory module combines UFS 2.2/3.1 storage and LPDDR4X technology in a compact and highly efficient design. With transmission rates of up to 3733Mbps*, this module delivers exceptional speed, energy efficiency, and reliability, making it the perfect choice for mobile smart terminals and IoT devices. Its high level of integration reduces device size and complexity, while advanced features like high-speed data transfers and low latency ensure outstanding system performance. Designed for modern applications, the uMCP module offers a premium solution for manufacturers looking to enhance device performance while optimizing space and power consumption.

Key Features:

• High-Speed Performance: Transmission rates up to 3733Mbps* for faster data transfers and reduced latency.
• Compact Design: Combines UFS 2.2/3.1 storage and LPDDR4X memory to reduce device size and complexity.
• Energy Efficiency: Operates at low voltages (VDD1: 1.8V, VCCQ: 1.2V), ensuring reduced power consumption.
• Advanced Technology: Supports high-performance storage and memory for improved system speeds and multi-tasking capabilities.
• Enhanced Reliability: Features SMART monitoring and error correction mechanisms to ensure data integrity and system stability.
• Custom Solutions: Provides flexible options for capacity, packaging, and labeling to meet specific application requirements.

Specifications:

• Product Name: uMCP
• Storage Capacity: 64GB - 512GB
• Standard: LPDDR4X
• Transmission Rate: Up to 3733Mbps*
• Operating Voltage: VDD1: 1.8V, VCCQ: 1.2V
• Operating Temperature: -25°C to 85°C
• Dimensions: 11.5 × 13.0 × 1.0 mm
• OEM Options: Custom capacities, packaging, and labels available.