Smart Wear and Storage Solution

ePOP

The ePOP (Embedded Package on Package) memory module integrates eMMC 5.1 and LPDDR4X technologies into a compact, high-performance package designed for modern mobile devices and IoT applications. Mounted on the CPU or host processor, it supports seamless high-speed data transmissions, reduces space requirements, and enhances energy efficiency. With transmission rates of up to 3733Mbps*, the ePOP module ensures reliable performance for wearable devices, smart terminals, and compact IoT systems. Its advanced architecture, combined with rigorous testing, makes it a trusted storage and memory solution for cutting-edge applications.

Key Features:

• High Integration: Combines eMMC 5.1 and LPDDR4X in a single compact package for reduced device size.
• High-Speed Performance: Supports transmission rates of up to 3733Mbps* to ensure faster data processing.
• Energy Efficiency: Operates at low voltages (VDD1: 1.8V, VCCQ: 1.2V) for extended battery life.
• Advanced Security: Includes SMART monitoring and error correction to enhance data integrity and system reliability.
• Versatile Applications: Optimized for use in wearable devices, compact IoT systems, and smart terminals.
• Customizable Solutions: Provides flexible options for capacity, packaging, and labeling to meet specific requirements.

Specifications:

• Product Name: ePOP
• Storage Capacity: 16GB - 512GB
• Standard: LPDDR4X
• Segmental Read Speed: Up to 300MB/s*
• Segmental Write Speed: Up to 100MB/s*
• Transmission Rate: Up to 3733Mbps*
• Operating Voltage: VDD1: 1.8V, VCCQ: 1.2V
• Operating Temperature: -25°C to 85°C
• OEM Options: Custom capacities, packaging, and labels available.