Compact Design with High Integration eMCP (Embedded Multi-Chip Package)

The eMCP (Embedded Multi-Chip Package) memory module is a highly integrated solution that combines LPDDR4X and eMMC in a compact 5-in-1 design. This innovative architecture reduces the computational burden on devices, making it the ideal memory solution for mobile devices, smart terminals, and IoT applications. Featuring transmission rates of up to 3200Mbps*, low voltage operation, and robust reliability, the eMCP module is designed to deliver superior performance while optimizing energy efficiency. Its small size simplifies product design, reduces space requirements, and lowers shipping costs, making it a preferred choice for manufacturers.

Key Features:

• High Integration: Combines LPDDR4X and eMMC in a compact 5-in-1 design for efficient performance and reduced space requirements.
• High-Speed Data Transfers: Supports transmission rates of up to 3200Mbps* for faster performance.
• Energy Efficient: Operates at low voltages (VDD1: 1.8V, VCCQ: 1.8V), reducing power consumption while maintaining high reliability.
• Enhanced Performance: Ideal for mobile devices, smart terminals, and IoT applications requiring fast and efficient memory.
• SMART Monitoring Support: Integrates self-monitoring and error detection technology for improved system stability and data protection.
• Custom Solutions: Offers tailored capacities, packaging, and labeling options to meet specific application requirements.

Specifications:

• Product Name: eMCP
• Storage Capacity: 32GB - 256GB
• Standard: LPDDR4X
• Transmission Rate: Up to 3200Mbps*
• Operating Voltage: VDD1: 1.8V, VCCQ: 1.8V
• Operating Temperature: -25°C to 85°C
• Dimensions: 11.5 × 13.0 × 1.0 mm
• OEM Options: Custom capacities, packaging, and labels available.